The semiconductor packaging world has yet again to gather in the 13th IWLPC – International Wafer-Level Packaging Conference which will be held in DoubleTree by Hilton Hotel, San Jose, CA this coming October 18-20, 2016. This conference allows packaging companies commonly known as OSATs (Outsourced Semiconductor Assembly and Test) to discuss and present the latest trend of the packaging evolution.
IC Packaging protects the fragile circuitry of a chip from the outside environment which may induce corrosion, electrical failure and over heating. This also connects the IC to the external device I/O.
During my 1st (hopefully not the last..) attendance of this conference, I was asked by the US immigration officer why I came to America and I responded “To attend a semiconductor packaging conference.”. I saw a bit of hesitation from his face and he said “A packaging conference?” before I can even answer, he then ask “Are you excited?”. I was super excited, having to meet top of the line Engineers who have developed several Packaging Technology is beyond amazing.
So, what is so special about Semiconductor packaging? With the current advancement of technology and the coming of Internet of Things (IoT), the need to create such complex IC while also driving the cost down has put the packaging industry into a whirlwind. Packaging has to adopt with the changes of the chip design with increasing number of I/O, smaller dimensions and tighter line/space requirement while continuously protecting the die from the harsh environment, low cost processing method and fast turn around.
In this conference, Major topics are 3D Integrations, WLP – Wafer Level Packaging and MEMS. The conference is sponsored by some gigantic and well known Semiconductor companies in the world. To name a few we have Applied Materials, Deca Technologies, JCET/StatsChipPac, Amkor and Lam Research.
If you wanna learn more about this conference, click here.